Online Registration: by Feb 19 , 2021 (Fri) at https://soipix.jp/form_TIA.html
(If you apply, we will send you an invitation email later.)
Registration Fee: free
For future quantum image sensor utilized in scientific, medical, and industrial applications, wider bandwidth of light and X-ray, which cannot be realized by silicon image sensor, is required with simple architecture of silicon image sensor. To overcome this, semiconductor material other than silicon vertically stacking on the silicon image sensor which is 3D stacking is focused. This workshop is based on TIA-Kakehashi project, "Toward realization of ultimate high band width image sensor" and will discuss such recent hetero-junction bonding technology.
